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英特尔披露Wildcat Lake芯片：算力最高40TOPS、功耗降低64%_我的网站
一 | 8月25日消息，据Wccftech报道，英特尔现已正式公布入门级处理器Wildcat Lake（酷睿Series 3） 的相关技术细节。
该系列主要面向入门级PC市场，在保留Panther Lake基础架构的同时，通过优化封装工艺、缩减Die面积、精简 I/O 配置以及改进主板设计，有效降低平台整体成本。 New Delhi, Oct 14 (UNI) India's indigenously built nuclear submarine INS Arihant on Friday carried out a successful launch of a Submarine Launched Ballistic Missile (SLBM) that hit the target with high accuracy.
"The missile was tested to a predetermined range and impacted the target area in the Bay of Bengal with very high accuracy. All operational and technological parameters of the weapon system have been validated," the Defence Ministry said.
"The successful user training launch of the SLBM by INS Arihant is significant to prove crew competency and validate the SSBN programme, a key element of India’s nuclear deterrence capability. A robust, survivable and assured retaliatory capability is in keeping with India’s policy to have ‘Credible Minimum Deterrence‘ that underpins its ‘No First Use’ commitment," the Ministry added.
INS Arihant is India's first indigenous nuclear submarine and the flagship of the Arihant-class of nuclear powered ballistic missile submarines that is based on the Russian Akula-1 class submarine.
The 6,000 tonne submarine was built under the Advanced Technology Vessel project at the Ship Building Centre in Visakhapatnam.
UNI ASU SHK1848。
在性能指标上，Wildcat Lake最高可提供40 TOPS的平台级AI算力，相较上一代Raptor Lake U Refresh（酷睿100系列）提升达2.7倍；创作与生产力性能最高可提升2.1倍，同时处理器功耗降低64%。
封装方案方面，英特尔并未沿用Panther Lake（酷睿Ultra Series 3）所采用的Foveros三维堆叠技术，而是转向有机多芯片封装（Multi Chip Package，MCP）与UCIe（Universal Chiplet Interconnect Express）互连方案，以降低封装成本和良率损失。
二 | 其中，MCP是将多个功能各异的裸芯片（Die）垂直堆叠或水平排列，共同封装在同一块有机基质载板上。
而UCIe作为半导体行业开放标准化的芯粒互连规范，定义了同一封装内不同芯片之间的通信协议，使来自不同厂商、采用不同制程节点的芯片能够像拼装积木一样灵活集成。 在制程选择上，Wildcat Lake的计算Die采用英特尔18A工艺，I/O Die则交由台积电N6工艺生产，且18A工艺原生支持双裸片方案的UCIe连接。
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Published on:16:02:06